Conference Program

  "Roadmap to Next-Gen EV & AV" Virtual Conference

March 23: Electric Vehicle Trends & Technologies

Add to Calendar
14:30 CET

(Paris Time)

9:30am EDT

(New York Time)

Conference Opening

Welcome and Conference Opening by EE Times Editors Junko Yoshida and Maurizio Di Paolo Emilio

14:35 CET
9:35am EDT


(EV1) Wide Bandgap Semiconductors Race in Electric Vehicle Systems

By Ana Villamor, Technology & Market Analyst, Power Electronics & Compound Semiconductors at Yole Développement

Electric and hybrid electric vehicles (xEVs) represent a healthy and growing market, driven by sustainable trends. We estimate that the demand for electrified vehicles will surpass 40 million units per year by 2026, boosted by many regulations and subventions from different countries. Major OEMs are, therefore, actively working on many PHEV (Plug-in Hybrid Electric Vehicle)  and BEV (Battery Electric Vehicle) models to be launched in the coming 5 years. BEV is an ideal segment for SiC adoption as the power levels for the main inverter are relatively high, meaning more power device content is required in the system. Therefore, the gain in efficiency from SiC in these systems can be relevant to increase driving ranges. As will be shown during the presentation, the adoption of 800V batteries for fast charging is another entry point for SiC in the xEV main inverter, and its adoption will rapidly increase in the next few years. In this presentation, we will give an overview of the xEV market and illustrate the potential for increasing use of WBG in different xEV systems, showing how these new semiconductors are expected to penetrate very rapidly creating a huge business in only a few years.

15:10 CET
10:10am EDT

(EV2) High Power and High Power Density EV Inverters Based on GaN Power Devices

By Alex Q. Huang, Professor, University of Texas, Austin

Today’s EV inverters are mostly based on matured Si IGBT technology in which high power IGBT modules are provided by the vendor. However, due to the inherent high switching loss, half of the IGBT EV inverters loss are in the switching loss, hence limiting their efficiency at full power. The high heat dissipation at full power is also a major challenge for the liquid cool system and large heatsink/cold plate is needed. The form factor of IGBT module is also large. Overall utilization of the cold plate surface area and EV inverter space is low. Due to significantly lower switching loss, SiC and GaN based EV inverters will have much lower switching loss, and the inverter loss is dominated by the conduction loss. Compare with SiC, GaN has additional advantage in terms of switching loss and packaging form factor. The surface mount type packages allow very low profile hence high-power density EV inverters be developed. In this talk, comparative study of Gan vs. IGBT vs. SiC are conducted for a 800V/100kW inverter. The design of a 800V/100kW GaN EV will be highlighted utilizing a three level inverter topology and 650V GaN.

15:30 CET
10:30am EDT

(EV3) SiC in EVs: In Search of The Perfect Switch

By Anup Bhalla, VP of Engineering, UnitedSiC

Semiconductor switches approach the ideal when they offer little resistance on current flow in the on-state, can withstand very high voltages in the off-state, and can switch between states with negligible wasted energy. We examine how SiC based switches approach this ideal, and how these properties are exploited to improve EV power electronics both on and off-vehicle, creating a massive cumulative benefit to drive EV adoption and improve overall energy use in transportation.

15:50 CET
10:50am EDT

(EV4) Panel Discussion: How Will Wide Bandgap Semiconductors Move EV Forward?

Panel Discussion with

  • Mark Münzer, Innovation & Emerging Technologies team at the High Power business line of ATV, Infineon
  • Dilder Chowdhury, Director, Strategic Marketing, Power GaN Technology, Nexperia
  • Filippo Di Giovanni, Wide bandgap Strategic Marketing Manager, STMicroelectronics

 moderated by EE Times Editor Maurizio Di Paolo Emilio

Electric vehicles (EVs) and hybrid electric vehicles (HEVs) are looking for power-conversion efficient solutions. They include several powertrain stages. Wide bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), provide superior performance compared to silicon: higher efficiency and switching frequency, higher operating temperature, and higher operating voltage.

16:40 CET
11:40am EDT

(EV5) Usage & differentiation of SiC vs Silicon MOSFET & IGBT in EV-HEV Applications

By Arthur Gonsky, PSG Technical Applications & Marketing Manager, On Semicondutor

ON Semiconductor, a leader in high power semiconductor solutions for the Automotive market, is positioned for further differentiation with the introduction of SiC discretes and modules. This presentation will provide an overview of the system performance benefits and usage of SiC, IGBT, and MOSFET technologies in EV-HEV applications.

17:00 CET
12:00pm EDT

(EV6) Next Generation of dependable High Voltage Discrete Power Products for Automotive Applications

By Wibawa T. Chou, Head of Automotive High Power Application and Innovation Engineering, Infineon Technologies

The proliferation of electrified vehicles have pushed the boundaries of power semiconductor performance to the next level. Silicon power devices have traditionally been used to control various power electronic systems in a car such as for main inverter motors, pumps, HVAC compressors, braking and steering systems. Recent advances in compound semiconductor materials such as Silicon Carbide (SiC) are enabling efficiency gains relative to silicon devices in most vehicle systems. Infineon is presenting SiC technology as the next generation of dependable high voltage discrete products for automotive OBC applications.

17:20 CET
12:20pm EDT

(EV7) How to Accurately Measure Hundreds of Amps While Reducing BOM, System Size, and Weight

By Georges El Bacha, Product Line Manager, Electric Vehicles Current Sensing, Allegro MicroSystems

Measuring current is a necessity for engineers, especially when it comes to electric vehicles. One of the major challenges, and critical tasks, is measuring hundreds of Amps to control the traction motor inverter. Efficiency and range are impacted by accurate measurements and quick response enables safe overcurrent detection. Learn about the latest current sensor technology that does not require a concentrator core.

17:40 CET
12:40pm EDT

(EV8) Benefits of SiC Technology for e-mobility

By Ardeshir Esmaeili, Product Marketing Engineer, STMicroelectronics

An introduction to silicon carbide as a wide bandgap material and the performances of SiC MOSFETs in electric vehicle systems. SiC MOSFETs will be positioned against other power transistor technologies, and the specific benefits of their use in traction inverters and on-board charges will be detailed.

18:00 CET
1:00pm EDT

(EV9) Wolfspeed SiC Empowers Vehicle Powertrain and Charging

By Guy Moxey, Senior Director of Power Products, Wolfspeed

As the electric vehicle market is expected to explode within the next several years, Wolfspeed understands the technological challenges that EVs present for engineers, especially when it comes to power and EV charging solutions. Join Wolfspeed’s Guy Moxey as he explores how silicon carbide can enable the high level of performance that the electric vehicle market demands today and in the future.

18:20 CET
1:20pm EDT

Conference Closing

March 24: ADAS and AV Trends & Technologies

Add to Calendar
14:30 CET

(Paris Time)

9:30am EDT

(New York Time)

Conference Opening

Welcome and Conference Opening by EE Times Editors Junko Yoshida and Maurizio Di Paolo Emilio

14:35 CET
9:35am EDT


(AV1) ADAS vs. Automated Vehicle Safety

By Phil Koopman, Co-Founder of Edge Case Research, Associate Professor, Carnegie Mellon University

There is a dramatic difference between safety requirements for cars with human drivers vs. those that use automation to do the driving. This talk looks at the differing needs for Assistive, Supervised, Automated, and Autonomous vehicles in terms of driver responsibility as well as sensor needs. Supervised vehicles tend to get credit for supporting the driver even with incomplete safety features. However, Automated vehicles have no human driver to handle edge cases, so the primary safety emphasis is likely to be on avoiding blame for gaps in system capability. Those differences affect sensor fusion strategies. Moreover, as vehicles assume more driving responsibility there will be a need for more comprehensive system safety practices and standards.

15:10 CET
10:10am EDT

(AV2) Sensor Modalities Are Greater Than The Sum of Their Parts!

By Phil Magney, Founder of VSI Labs

There is no perfect sensor, yet. All sensors have limitations and there is not one sensor that can handle any application or level of automation. Most active ADAS solutions rely on at least two sensors because they are complimentary. For example, visible cameras plus radar are complimentary for Level-one applications such as adaptive cruise or automatic emergency braking (AEB). The resulting combination creates the right balance between safety and cost. At the higher levels of automation (L4/5) you need all modalities for obvious reasons. Cost is less of an issue here. You need lots of eyes (up to 12 cameras), and you better be accurate with your measurements. That means you need lots of radar surrounding the vehicle. Add Lidar to give you the accuracy to localize against your surroundings. Lastly, you need redundancy and lots of it. Your confidence thresholds increase exponentially as you move up the scale from L1 to L2 to L3 to L4 and beyond.

15:30 CET
10:30am EDT

(AV3) Auto Electronics System Architecture: Disruption on The Way

By Egil Juliussen, former Director Research, Infotainment & ADAS at IHS Automotive, now an independent auto industry analyst,  EE Times “Egil’s Eye” columnist

Egil Juliussen will offer in his keynote perspectives on the following issues:

  • What are the driving forces for auto electronics systems? Software & hardware?
  • What does software-defined car mean? What is the electronics system architecture impact?
  • What is the impact of key hardware technology changes?
  • How do business model disruptions impact electronics system architecture?
15:50 CET
10:50am EDT

(AV4) Panel Discussion: Where is the dividing line between AV and ADAS?

Panel Discussion with

  • Danny Shapiro, senior director of Automotive, Nvidia
  • Chet Babla, vice president of Automotive Business, Arm
  • Shelly Van Dyke, vice president & head of strategy, Automotive Processing & Automotive Segment, NXP
  • Doug Burcicki, senior director, Global Automotive and Heavy Equipment, Integrated Electrical Systems Division of Siemens Digital Industries Software

moderated by EE Times Editor Junko Yoshida

The panel tackles one of the thorniest questions about AV and ADAS. We ask our panelists:

  • Is AV placed at the end of the evolutionary path of ADAS?
  • What separates AVs from ADAS -- legally, socially, economically and technically?
  • Requirements for sensors and processors for AVs and ADAS: How far apart are they?
  • Do OEMs look for a single platform where their ADAS can grow into AV, or two separate platforms?
16:40 CET
11:40am EDT

(AV5) Automotive engineering: The impact of the increasing pace of AV technology development

By Morahari Reddy, Product Manager Automotive Technologies, TechInsights

Since the formation of Uber ATG triggered the autonomous vehicle (AV) race, AV companies have been racing to deploy technology in the shared mobility market. With few providers already launching AV fleets in suitable geographies, the technology demand has outpaced the supply, but the industry is mitigating it through acquisitions, partnerships, and innovation. As the proportion of AV increases in fleet vehicles, so does utilization and productization, increasing the speed of product development in this space. This allows for every iteration of AV to improve significantly over previous generations at the semiconductor and software level, further highlighting the relevance of competitive intelligence in the automotive space.

17:00 CET
12:00am EDT

Conference Closing

March 25: EV/AV Trends & Technologies

Add to Calendar
14:30 CET

(Paris Time)

9:30am EDT

(New York Time)

Conference Opening

Welcome and Conference Opening by EE Times Editors Junko Yoshida and Maurizio Di Paolo Emilio

14:35 CET
9:35am EDT


(TT1) Next-Generation Battery Management Enables New Opportunities for Hybrid & Electric Vehicles

By Ivo Marocco, Director of Marketing and Business Development - Battery Automotive Products for EV/HEV, Texas Instruments

As the automotive world shifts from internal combustion engines to hybrid and fully electric vehicles, requirements for battery management solutions are constantly changing. Engineering EV battery packs requires more rigor around error detection accuracy when measuring current, voltage and temperature. Higher-accuracy error detection also addresses the latest standards for safety and diagnostics required in HEV/EVs. This session will highlight how Texas Instruments is aligning with automotive manufacturers to accelerate this transition to hybrid and electric vehicles, with the ultimate goal to eliminate CO2 emissions while overcoming the technical barriers to EV adoption.

14:55 CET
9:55am EDT

(TT2) Panel Discussion: Powertrain Technologies for EV Design

Panel Discussion with

  • Mike Kultgen, General Manager, Battery Management Systems, Analog Devices
  • Joseph Notaro, Vice President - WW Automotive Strategy and Business Development, ON Semiconductor
  • Mike Doogue, Sr. VP, Technology and Products, Allegro

moderated by EE Times Editor Maurizio Di Paolo Emilio

The electric vehicles (EVs) revolution is speeding up the trend towards a more sustainable future. The performance keys in the EV design are the battery and the propulsion system. The design parameters involve power level, conversion efficiency, operating temperature in the vehicle powertrain system, thermal energy dissipation capacity, and system package.

15:45 CET
10:45am EDT

(TT3) Why Do We Need Driver Monitoring System?

By Colin Barnden, lead analyst at Semicast Research, EE Times “Seriously Skeptical” columnist

We all get tired and distracted, and some days have a busy head too. Sitting on the couch or behind a desk, none of this is life-threatening. But sitting behind the wheel of a car traveling at highway speed, all of this is life-threatening. Disengaged, distracted and drowsy drivers kill themselves and other road users. Why are advisory and regulatory bodies demanding use of driver monitoring systems? Because road safety is for everyone.

16:05 CET
11:05am EDT

(TT4) Panel Discussion on Driver Monitoring

Panel Discussion with

  • Colin Barnden, lead analyst, Semicast Research
  • Caroline Chung, Senior Business Development Manager, Veoneer
  • Nick DiFore, senior vice president, general manager, Automotive at Seeing Machines
  • Willard Tu, senior director, Xilinx
  • Andy Hanvey, director of automotive marketing, Omnivision

moderated by EE Times Editor Junko Yoshida

The automotive industry is looking into new technologies to monitor the status of the driver and occupants inside a car. As they introduce more automated features into their vehicles, carmakers see it imperative to detect the driver’s alertness and attention to the driving task. The panel will explore the state-of-the-art DMS technologies – today and tomorrow, DMS requirements for sensors and processors, various ways to implement DMS algorithms (pros and cons) inside a vehicle, and discuss what exactly OEMs and tier ones are look for in DMS.

16:55 CET
11:55am EDT

(TT5) Automotive In-Cabin Sensing with Xperi

By Petronel Bigioi, CTO Xperi

Not long ago, consumers would choose cars based on the exterior appearance and engine power, while the interior had little or no influence on the decision to buy. This is about to change as the industry shifts from driver to occupancy focus, from basic monitoring to advanced monitoring and from safety as the main feature, to safety as an implicit part of the user experience. Xperi is focusing on the next generation in-cabin sensing and is taking the lead in designing the cabin of tomorrow. Learn about in-cabin sensing advancements and find out which consumer experiences can be unlocked in the car of the future.

17:15 CET
12:15pm EDT

(TT6) Vishay 48V eFuse - Enabling the Elimination of the Arcing Problem in the Boardnet

By Scott Blackburn, Manager of Automotive Field Applications, Vishay Intertechnology

With the arrival of 48V boardnet systems a new method of safely connecting and disconnecting high current loads (e.g. electric power steering, electric turbo charger, etc.) to the battery is required due to the problems associated with arcing that occurs when using mechanical relays. Therefore, an electronic fuse (eFuse) has been designed to switch loads up to 200A at 48V on a compact double-sided FR4 PCB with passive cooling. This design also features a pre-charge function to limit any potential in-rush current to an acceptable level, and continuous current measurement for use by the vehicle’s body control module to monitor the state of health of the battery. This presentation will demonstrate the benefits of this innovative design, enabling the elimination of the arcing problem in 48V boardnet systems.

17:35 CET
12:35pm EDT

(TT7) Addressing package technology to meet the demands of EV

By Dr Dilder Chowdhury, Director Strategic Marketing, Nexperia

As the demand for electric vehicles increases so does the requirement of power semiconductors which provide highly efficient power conversion at increasingly higher switching frequency. The move from traditional Si to WBG such as Power GaN FETs needs to be matched with the right package innovation to meet the demands of electrification of the powertrain. As the innovators of copper-clip package technology, Nexperia now brings two decades experience of producing high-quality, high-robustness SMD packaging to its GaN FET portfolio. Adopting proven technology to give industry-leading performance in a truly innovative compact package. Wire-bond free for optimized thermal and electrical performance, and simplified design of cascode configuration to eliminate the need for complicated drivers and controls, CCPAK provides the robustness and reliability for the most demanding EV designs. Meeting the requirements of automotive qualification and produced in a scalable manufacturing footprint which can rapidly increase with market demand.

17:55 CET
12:55pm EDT

(TT8) Model-based design of cascaded speed and current controls for a 6-phase PMSM

By Dr. Sisi Zhao, Application Engineer, Plexim

Multi-phase Permanent Magnet Synchronous Machines (PMSM) are used for high performance drive systems like electric vehicles (EV). They offer increased power capability and reliability over their three-phase counterparts. This technical session introduces a workflow for the model based design of the controls for a dual-star PMSM with two inverters attached to different energy sources. The complete system is deployed using a TI embedded target for the controls and a virtual plant model running on the RT Box real-time simulation platform.

18:15 CET
1:15pm EDT

Conference Closing